Deliverables list
Deliverable reports
| Del. No. | Deliverable title | WP No. | Lead Participant | Person Months | Delivery date (proj. month) | Nature | Dissemination level |
|---|---|---|---|---|---|---|---|
| D1 | Agreed list of candidate substrate materials | A | TWI | 24 | 1 | Report | RE |
| D2 | A specification describing & defining test structure | 2 | Report | RE | |||
| D3 | A design for the evaluation circuit | 3 | Report | RE | |||
| D4 | Specification describing & defining test methods | 3 | Report | RE | |||
| D5 | A matrix of defined processing conditions and equipment set-ups | B | Epigem | 40 | 3 | Report | CO |
| D6 | Initial report on findings | 7 | Report | CO | |||
| D7 | Optimisation plan for substrate materials | C | BUTE | 31.6 | 8 | Report | CO |
| D8 | An interim report of test data from the optimised substrate materials processed under a variety of conditions (lead & lead-free solders) | D | Flex Tech | 33.1 | 12 | Report | CO |
| D9 | Selected list of most promising substrates to progress to component attachment evaluation | 13 | Report | CO | |||
| D10 | Optimised process conditions for tin/lead & lead-free reflow & wave solder procedures | E | TWI | 19.5 | 12 | Report | RE |
| D11 | Full assembly build of test substrates & components using lead-free solder & tin/lead solder as a benchmark | 14 | Report | CO | |||
| D12 | Optimised process conditions for electrically conductive paste & tape assembly reflow procedures | F | Komed | 22.9 | 13 | Report | RE |
| D13 | Optimised processing conditions for laser reflow methods | 13 | Report | RE | |||
| D14 | Full assembly build of test substrates & components using electrically conductive paste & tape | 15 | Report | CO | |||
| D15 | Reliability test results of the assembly test boards | G | BUTE | 19.4 | 17 | Report | CO |
| D16 | Interim Report detailing reliability testing results | 19 | Report | CO | |||
| D17 | Results of materials data for initial predictive model | H | UOG | 11.8 | 20 | Report | CO |
| D18 | Completion of initial prediction analysis | 21 | Report | CO | |||
| D19 | Results of the preliminary life predictions & recommendations | 22 | Report | CO | |||
| D20 | DFM guidelines for lead-free flexible circuit board assembly | I | TWI | 10.8 | 23 | Report | RE |
| D21 | Final Technical Report | 23 | Report | RE | |||
| D22 | Project Presentation | J | TWI | 9.9 | 3 | Report | PU |
| D23 | Midterm Report | 12 | Report | CO | |||
| D24 | Public Website activated | 13 | Website | PU | |||
| D25 | Final Project Report | 24 | Report | CO | |||
| D26 | Plan for use and dissemination of knowledge | 24 | Report | RE |
European Commission
