Other enterprise/end user profiles
KIC Europe
Company profile
KIC is committed to providing innovation that works. They are dedicated to total thermal process improvement and total customer satisfaction. Their innovative products and services are designed to improve a variety of thermal monitoring, profiling and process control applications. Their customers are among the most demanding in the industry, stimulating us to continually develop new products and services to meet those needs. KIC's innovative technologies are at work in thousands of leading edge companies world-wide in numerous industries.
KIC products and services are: Solder Re-flow, Wave solder and curing, SMT Re-flow/curing Wave solder - solder. Semiconductor and Hybrid Brazing and Heat Treatment. Powder Coating.
KIC's contribution to the project will be to loan the use of profiling equipment and process optimisation software for the duration of the project and provide support and training.
Freudenberg & Co (FFD) Germany
Company profile
The Freudenberg Group is a diverse company with activities in Seal Control, Technology, Nonwovens, Household Products, Speciality Lubricants, Flexible PCBs, Systems and Tool engineering as well as IT Services. The Freudenberg Group's organisation shows a decentralised structure. The business is handled by autonomous companies that are merged to form segregated business groups. The function of the parent company is to co-ordinate and supervise the Group's activities as well as to advise and support the groups. The Freudenberg Group is primarily a supplier to a wide range of industries, Its customers being in the automotive, capital goods as well as the textile and garments sectors.
FFD, the former central R&D Division of Freudenberg, is now an independent company since 1995 within the Freudenberg Group. They are co-operating with the different Business groups as a project partner for R&D. They mainly support Freudenberg Mektec, a producer of Flexible Printed Circuits and Freudenberg NOK Mechatronics, a producer of large size FPC for car on board supply systems, in advanced development and in national and European development projects.
For these companies lead free soldering on Flex is a big issue. The company have gained a lot of experience in selective soldering with eutectic solder on low temperature substrates like PVC, PA, PET. These substrates are applied in the smart card and electronic tagging industry. They would like to investigate selective soldering with lead free solder on Flex substrates with low cost and low temperature plastic films which are very interesting for the European car industry too. As alternative they would also like to investigate the joining technology with conductive adhesive, which gives reliable joints under automobile conditions.
Freudenberger will contribute to:
- Screening, developing and selection of lead free solder and solder paste and of conductive adhesive.
- Development of selective soldering processes for lead free solder like selective wave soldering, hot air soldering, laser soldering and impulse, heated bar soldering.
- Development of assembly processes with conductive adhesive for car application.
- Investigation of substrate properties during and after assembling.
- Characterisation of process window and first pass yield.
- Life performance and reliability study on assembly.
- Their markets, in the automotive and smart card, especially will benefit from the results of this project.
Emerson & Cuming Belgium
Company profile
Emerson & Cuming's focus has been on the designing and manufacturing high power performance solutions for industries around the world. Their expansive breadth of encapsulant, adhesive, and thermal management technologies combined with their decades of experience allow them to create solutions to difficult engineering challenges, providing maximum design latitude for our customers. Their vision is to be the first choice for circuit and component assembly solutions. They offer real solutions for virtually any environment. For demanding applications, they deliver the highest quality material systems including.
Adhesives, chip on board, conformal coatings, conductive adhesives/solder replacement, die attach adhesives, encapsulants, film adhesives, flip chip underfills, solder alternatives, surface mount adhesives, thermal management. Emerson & Cuming products have been engineered to protect critical components from harsh operating environments. With formulations of epoxy, polyurethane, and silicone chemistries. They are capable of a solution regardless of the application specifications.
Participation in this project will lead to advancement of knowledge in technology adhesives, coatings and encapsulants, including materials that are electrically conductive, thermally conductive and non-conductive. Markets which will benefit from this knowledge include electronic circuit assembly and assembly of electric and electrochemical components.
European Commission
