Partnership:
Consortium overview
| Organisation | Contact Details | Type | Size | Country | Organisation's business activity | R&D function in the project |
|---|---|---|---|---|---|---|
| EPIGEM | Unit 3 Malmo Court, Kirkleatham Business Park, Redcar, UK, +44 1642 496303 |
SME | S3 | UK | Polymer material supplier | Material selection. Manufacturer of flexible substrates material. Development flex-circuits. |
| ELDOS | Bacciarellego 54, Wroclaw 51-649, Poland +48 71 3705 180 |
SME | S4 | PL | Manufacturer of printed circuit boards | Review of substrate materials. Supply of flexible substrates. Manufacture flex-circuits. |
| Flexible Tech | Townhead, Rothesay, Bute, Scotland, UKPA20 9JH, +44 1700 504515 |
SME | S4 | UK | Manufacturer of flexible circuit boards | Design and layout of substrate materials. Development of substrate materials. |
| GTS | 41 Rassau Industrial Estate, Ebbw Vale, NP23 5SD, UK, +44 1495 307060 |
SME | S3 | UK | Supplier of electrical laminates, and heat activated tapes | Materials selection and development. Supply of flexible substrates. Develop optimised substrate material. Manufacture of flexi -circuits. |
| ICR | Research Department, Moritz-von-Rohr-Str.1a, Jena D-07745, Germany +49 3641 634422 |
SME | S3 | D | Material science. Long-term behaviour, failure analysis | Definition of process & test regime. Review substrate materials. Assembly of flexi-circuit. |
| KOMED | Reitter F.u. 46-48, Budapest H -1135,Hungary, +36 1 340 3115 |
SME | S3 | HU | Manufacture of EEG units. Baby incubators and resuscitation units | Review of solder alloys. Review results of substrate materials. Processing sample flexible substrates. |
| Flex-Ability | Prospect Way, Park View Industrial EstateHartlepool, UK, TS25 1UD +44 1429 860233 |
SME | S4 | UK | Manufacturer of Flexi-circuit boards | Design and layout of substrate materials. Processing sample flexible substrates. |
| TWI | Granta Park, Great Abington, Cambridge, CB1 6AL, UK, +44 1223 891162 |
RTD | S5 | UK | Materials & Joining technology for electronics. | Processing samples flexible substrates. Assembly of flexi-circuit boards. Failure investigation. |
| BUTE | Department of Electronics Technology Goldman t.3, Budapest H-1521, Hungary +36 1 463 2740 |
RTD | S7 | HU | Electronic circuits and systems, printed circuit technology. | Design layout of flexi-circuits. Evaluation of mechanical, electrical & moisture properties. Review of results. Specification of components. Reliability testing. |
| UOG | Park Row, Greenwich SE10 9LS, UK +44 20 8831 8660 |
RTD | S7 | UK | Virtual Qualification & Reliability Modelling. | Develop life prediction tool. |
| FFD | Applied Physics Department, Bau 35Weinham D-69465, Germany +49 6201 805889 |
OTH | S3 | D | Manufacturer Smart card/electronic tagging/car industry | Screening/developing lead free solder/conductive adhesive/assembly process/life performance reliability on assembly. |
| KIC | R&D Department, Roma 00153, Italia +39 06 4547 3670 |
OTH | S6 | UK | Thermal monitoring, profiling and process control applications | Develop lead free re-flow profile and wave soldering prediction software tool. |
| E&C | R&D Department, Nijverheidsstraat 7,Westerloo B-2260, Belgium +32 14 57 56 11 |
OTH | S7 | B | Supplier of conductive, adhesive paste & tape materials | Provide conductive adhesive paste/tape/process optimisation expertise. Failure investigation. |
European Commission
