Summary of workpackages
| Work-package no. | Workpackage title | Lead contractor |
Person- months |
Start month |
End month |
Deliverable No. |
|---|---|---|---|---|---|---|
| WP-A | Substrate Material Selection, Circuit Design and Test Specification | TWI | 24 | 1 | 3 | D1, D2, D3 and D4 |
| WP-B | Substrate Evaluation using Thermal Processes | Epigem | 40 | 3 | 8 | D5 and D6 |
| WP-C | Optimisation of Substrate Materials for Thermal Processes | BUTE | 31.6 | 8 | 10 | D7 |
| WP-D | Evaluation of Optimised Substrate Materials | Flex Tech | 33.1 | 10 | 13 | D8 and D9 |
| WP-E | Assembly Evaluation using Thermal Processes | TWI | 19.5 | 10 | 15 | D10 and D11 |
| WP-F | Assembly Evaluation using Alternative Processes | Komed | 22.9 | 10 | 15 | D12, D13 and D14 |
| WP-G | Investigation of Life Performance Reliability | BUTE | 19.4 | 15 | 19 | D15 and D16 |
| WP-H | Development of Life Prediction Tools | UOG | 11.8 | 19 | 22 | D17, D18 and D19 |
| WP-I | Capture and Embedding of Acquired Knowledge | TWI | 10.8 | 22 | 24 | D20 and D21 |
| WP-J | Project Co-ordination | TWI | 9.9 | 1 | 24 | D22, D23, D24, D25 and D26 |
| Total | 223 | |||||
European Commission
